Wet etching

We offer etching of a variety of substrates and deposited layers using wet-chemical processes.

Processes include controlled and reproducible etching of:

  • silicon dioxide layers
  • poly- and monocrystalline silicon layers
  • silicon nitride and silicon oxide layers
  • thin metallic layers – e.g. aluminum, titanium and others

Each process can also be performed in production mode on 100 mm/4”, 125 mm/5”, 150 mm/6” and 200 mm/8” substrates in batch mode (up to 25 substrates) and dry- -in/dryout.

Keywords: wet etching, controlled etching, reproducible etching, dry-in dry-out

contact: uslugi.cezamat@pw.edu.pl

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